| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an electronic equipment having high reliability even when an electronic component having unevenness in shape and dimension is included in the assembling component. SOLUTION: This working system comprises a laser working unit 220 for working to drilling a substrate 20, an information processing unit 210 for controlling the working unit 220, and an external storage unit 200 for previously storing managing information 201. The information 201 stored in the storage unit 200 stores an ID 201A and an actually measuring the size 201B of a lateral width S3 of an IC chip, sequentially deflected to match the order of using. The processing unit 210 reads the size 201B corresponding to the youngest ID from the information 201, and calculates an added value of the size 201B and a predetermined marginal value as a lateral width size of a square through hole. Here, a working command T2 including a calculated lateral width size or the like is imparted to a laser working machine 220. Thus, an IC chip specified by the ID referred by the unit 210 is disposed in the through hole formed thereby. |
