发明名称 METHOD FOR TRANSFERRING WAFER IN SEMICONDUCTOR DEVICE ION IMPLANTER
摘要 PURPOSE: A method for transferring a wafer in a semiconductor device ion implanter is provided to improve operation efficiency of a transfer robot by performing continuously an unloading process and a loading process. CONSTITUTION: A plurality of wafers(W) are loaded into each loadlock chamber(14a,14b,14c). A plurality of sites(22) are formed on a disc(20). A transfer robot(16) has a robot arm(18) for transferring the wafers(W). The transfer robot(16) performs an unloading process for unloading the processed wafer(W) of the site(22) of the disc(20) into an empty slot of a cassette(C). The transfer robot(16) moves the robot arm(18) to a target wafer of the cassette. The transfer robot(16) performs a loading process for loading target wafers(W) on the sites(22) of the disc(20). A predetermined process is performed by rotating the disc(20) and the next wafer is prepared.
申请公布号 KR20030014820(A) 申请公布日期 2003.02.20
申请号 KR20010048699 申请日期 2001.08.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HYO JIN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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