发明名称 |
Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board |
摘要 |
A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.
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申请公布号 |
US6521069(B1) |
申请公布日期 |
2003.02.18 |
申请号 |
US20000492781 |
申请日期 |
2000.01.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUGAYA YASUHIRO;INOUE OSAMU;KATO JUNICHI |
分类号 |
B28B11/00;C04B35/622;C04B35/632;C04B35/64;H01L21/48;H01L23/12;H01L23/13;H05K1/03;H05K3/06;H05K3/46;(IPC1-7):B32B31/26;H01L23/15 |
主分类号 |
B28B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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