发明名称 |
Method for making a semiconductor chip package |
摘要 |
A method for making a semiconductor chip package. At least one compliant pad is provided on a surface of a substrate and a chip unit is attached to the at least one compliant pad. The at least one compliant pad has a first coefficient of thermal expansion ("CTE"). An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed around the at least one compliant pad to form a composite layer between the chip unit and the substrate. |
申请公布号 |
US6521480(B1) |
申请公布日期 |
2003.02.18 |
申请号 |
US20000672208 |
申请日期 |
2000.09.28 |
申请人 |
TESSERA, INC. |
发明人 |
MITCHELL CRAIG;WARNER MIKE;BEHLEN JIM |
分类号 |
H01L21/56;H01L21/60;H01L23/48;H01L23/498;H05K1/11;H05K3/36;H05K3/40;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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