| 摘要 |
PROBLEM TO BE SOLVED: To connect the electrodes without bringing about short-circuiting between the adjoining electrodes as the connection resistance between the electrodes is made small in the connection method of the anisotropy conductive film and the integrated circuit device using the same. SOLUTION: An anisotropy conductive film is formed by dispersing conductive particles 2 in the thermosetting resin 1 and by pasting the ultraviolet-hardening resin 3 on both sides of the thermosetting resin 1, and the ultraviolet resin is hardened by ultraviolet rays in advance of thermo-compression bonding and a barrier of the hardened ultraviolet resin material is formed so that the conductive particles may not enter into the adjoining electrodes at the time of thermo- compression bonding, thereby, short-circuiting by migration is prevented.
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