| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding wire for connecting an electronic circuit that is superior in bondability when ball-bonded to a thin film on a glass substrate and superior in wire drawing properties. SOLUTION: A clad wire is characterized in that a core material is composed of Zn, Sb, In, or an alloy of them, and a cladding-material comprising Au or an alloy of Au is coated on its outer circumferential surface. The quantity of the core material in the clad wire is determined so that, when the clad wire is melted and solidified, a Zn content is 0.1-30 mass%, a Sb content is 0.1-30 mass%, or an In content is 0.1-50 mass%. |
