| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad capable of effectively suppressing adhesion of foreign matters such as dust particles and generation of scratches on the surface to be polished. SOLUTION: This polishing pad, which is used to polish an object, is characterized in that the average grain size, after polishing, of the abrasive grains in the abrasive slurry used for the polishing can be adjusted to 1.5 times the average grain size or smaller before polishing and the surface D hardness is 65 degrees or higher. |
