| 摘要 |
The device (1) for separating substances (S), where each substrate comprises two adjoining wafers with an intermediate cleavage plane, comprises means for supplying a set of substrates arranged in the direction of storing for prior separation, means for separating the substrates including a mobile set (12) with two main parts (121,122) in the form of combs laid out symmetrically with respect to the median plane (120), two gripping parts (121a,121b) in the form of jaws mounted with possibility of rotation in the horizontal plane on two respective arms (1210a,1210b), two gripping parts (122a,122b) mounted on two respective arms (1220a,1220b), and means including the main part (121) and the mobile gripping parts (121a,121b) for a controlled displacement of certain wafers of substrates after separation in a direction substantially parallel to the direction of storing the substrates. The device can separate a set of substrates, e.g. 25, simultaneously or sequentially. The means for supplying substrates comprise a pusher which can raise the arranged substrates to a support of cradle type. The gripping parts can maintain the substrates when in contracted states. Each gripping part comprises two parts with concave openings for receiving and maintaining the substrates. The geometry of the openings is adapted so to favour the separation of each substrate by a cooperation of the forms of the openings of the two parts of the gripping part. The concave opening comprises a central projecting element in teh form of a ridge designed for engaging the substrate at the level of its cleavage plane. Each concave opening of the two parts has an asymmetric profile and comprises two walls with different incidence angles. The device comprises three stations (ST1,ST2,ST3), each equipped with a pusher, the first for receiving the substrates for separation, and the other two for receiving the wafers of separated substrates. The device is also specified in a second embodiment. The method is claimed that is implemented by teh device. An application of the method is for separating substrates coming from an operation of type SMARTCUT, where the first wafer of the substrate corresponds to a Silicon On Insulator (SOI) substrate, and the other wafer corresponds to a remainder of semiconductor material such as silicon. |
