INPUT-OUTPUT TERMINAL, PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the operating property and reliability during a communication-characteristic maintenance of an optical semiconductor element by suppressing the occurrence of burrs in grooves formed on the end faces of a plate section in the input-output terminal of an optical semiconductor package. SOLUTION: In the input-output terminal 3, a grounding conductor layer 14 is formed on the lower surface of the plate section 8 and the grooves 6 are formed on one-side end face and/or the other-side end face of the plate section 8 from metallized wiring layers 3a to the grounding conductor layer 14. In addition, conductor layers 6a which electrically connect the wiring layers 3a to the conductor layer 14 are formed in the grooves 6. The widths of the grooves 6 are made to gradually become narrower toward their bottom sides.