| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when plated metallic coating layers are formed on the surfaces of metallized wiring conductors provided on the upper surface of a ceramic wiring board, the plating liquid, etc., infiltrates into a thick film circuit provided on the lower surface of the wiring board through dividing grooves and corrosion, peeling, etc., occur in the thick film circuit. SOLUTION: The ceramic wiring board 6 is obtained by respectively forming the metallized wiring conductors 2 coated with the plated metallic layers, and the thick film circuit 5 coated with a coating layer 4 of an organic resin on the upper and lower surfaces of each square area 1a formed by dividing a mother ceramic substrate 1, by forming longitudinal and transversal dividing grooves 3 at least on the lower surface of a mother ceramic substrate 1. The coating layer 4 also covers the dividing grooves 3 formed in the outer peripheral section 1b of the lower surface of the substrate 1. Consequently, the occurrence of corrosion, peeling, etc., in the thick film circuits 5 can be prevented and the reliability of the ceramic wiring board 6 can be improved by effectively preventing the infiltration of the plating liquid, etc., into the circuits 5 from the dividing grooves 3 provided in the outer peripheral section 1b of the substrate 1.
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