| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component having a high yield by suppressing a structural defect caused by a cutting step. SOLUTION: The method for manufacturing the ceramic electronic component comprises the steps of fixing a laminated block 11 obtained by alternatively laminating a ceramic sheet and a conductor layer, onto a pedestal 10, push cutting the block 22 by a cutter 12 made of a metal, then moving the cutter 12 in parallel, cutting plural times the block 11 while confirming a cutting position, thereby obtaining a laminate, cutting at this time while removing the block component adhered to the cutter 12, then baking the laminate and forming an external electrode.
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