| 摘要 |
This specification discloses an anti-EMI device used in electronic products. The device contains a U-shape component and a spring component. The U-shape component is embedded inside the housing of an electronic product for fixing and connecting the anti-EMI device to the electronic product. The spring component is used to shield the EMI from the electronic product. The spring component is connected to the bottom surface of the U-shape component, extending along both sidewalls toward the opening of the U-shape component and protruding out of the electronic product housing.
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