| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which can improve the adhesive property of a sealing resin and a lead frame on which the surface is formed with nickel while maintaining a mold release property of the sealing resin and a mold. SOLUTION: The composition comprises an inorganic filler, an epoxy resin and a curing agent. A salt of 1,8-diazabicyclo(5,4,0)undence-7 and a trimellitic acid or pyromellitic acid is added after previously melt-mixing with a phenol novolac resin.
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