| 摘要 |
PROBLEM TO BE SOLVED: To provide a negative photoresist composition for a thick film which has high sensitivity and preferable durability against plating and which is suitable for formation of a thick film preferable as a material to form bumps, and to provide a photoresist film and a method for forming bumps by using the photoresist film. SOLUTION: The negative photoresist composition for a thick film contains (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid producing agent. The photoresist film having 5 to 100 μm film thickness is obtained by applying the above composition on a base material and drying. In the method for forming bumps, the above composition is applied on the substrate of electronic parts, patterned and subjected to plating. |
