| 摘要 |
<p>An electrode structure where a sacrifice film is removed without removing another insulating film and a method for manufacturing a thin-film structure. There are formed anchor holes (52) for opening the surface of a wiring line (45) which is covered with a sacrifice film (51) and a nitride film (47). The anchor hole (52) is formed of a hole portion (47c) of the nitride film (47) and an opening (51a) of the sacrifice film (51). The diameter of the hole portion (47c) is smaller than the width of the wiring line (45) by a first predetermined distance (d1) from the edge (45a) of the surface of the wiring (45). The diameter of the opening (51a) is larger than the diameter of the hole portion (47c) by a second predetermined distance (d2) from the hole portion (47c). Because of the presence of the first and second predetermined distances (d1, d2), the distance by which the etchant for removing the sacrifice film (51) penetrate into an oxide film (33).</p> |
