| 摘要 |
PURPOSE: A jig device used in semiconductor fabrication equipment using plasma is provided to improve reliability of a semiconductor device by removing effectively organic materials in a cleaning process and increasing surface energy to enhance adhesive strength. CONSTITUTION: An insulating base plate(1) is fixed on a lower bottom face of a vacuum chamber. The insulating base plate(1) is fabricated by using epoxy, teflon, and ceramics. The first and the second jig support plates(3a,3b) are supported and fixed at both sides of the insulating base plate(1). The first and the second jig support plates(3a,3b) are electrically connected with a cathode bus bar(8) and an anode bus bar(7). Each upper portion of the first and the second jig support plates(3a,3b) are fixed by a jig support bar(5). An anode antenna(25) and a cathode antenna(26) are arranged between the first and the second jig support plates(3a,3b). The anode antenna(25) and the cathode antenna(26) are electrically connected with the first and the second jig support plates(3a,3b), respectively.
|
