发明名称 Method of manufacture of printed wiring boards having multi-purpose finish
摘要 A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
申请公布号 US6517893(B2) 申请公布日期 2003.02.11
申请号 US20010941086 申请日期 2001.08.28
申请人 LUCENT TECHNOLOGIES INC. 发明人 ABYS JOSEPH A.;FAN CHONGLUN;SMITH BRIAN T.;STACY BRUCE F.;XU CHEN
分类号 H05K1/09;C25D5/12;C25D7/00;H05K3/06;H05K3/10;H05K3/22;H05K3/24;H05K3/28;H05K3/38;(IPC1-7):B05D5/12 主分类号 H05K1/09
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