LEAD-FREE GLASS, GLASS FRIT, GLASS PASTE, ELECTRONIC CIRCUIT PART AND ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a lead-free glass that can be used as a binding material of a paste for electronic circuit parts and a paste for overcoating electronic circuits or the like. SOLUTION: This lead-free glass substantially comprises 56-88 wt.% Bi2 O3 , 5-30 wt.% B2 O3 , 0-5 wt.% SnO2 +CeO2 , 0-20 wt.% ZnO, 0-15 wt.% SiO2 , 0-10 wt.% Al2 O3 0-10 wt.% TiO2 , 0-5 wt.% ZrO2 , 0-8 wt.% Li2 O, 0-8 wt.% Na2 O, 0-8 wt.% K2 O, 0-10 wt.% MgO, 0-10 wt.% CaO, 0-10 wt.% SrO, 0-10 wt.% BaO, 0-5 wt.% CuO, 0-5 wt.% V2 O5 , 0-5 wt.% F.