| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of unestablished manufacturing method for manufacturing high quantity small and thin circuit devices, with its circuit elements being mounted on a support substrate such as a ceramic substrate, a flexible sheet. SOLUTION: The circuit device comprising a plurality of conductive patterns 51 of each mounting section electrically isolated by a isolation groove 61, a thermosetting resin layer 50A filling the separation groove 61 and covering a surface of the conductive patterns 51, an insulation resin 50B covering the circuit element 52 and coupling to the thermosetting resin layer 50A and is capable of improving an adhesive strength between the isolation groove 61, and the thermosetting resin layer 50A and the insulating resin 50B, is realized. |
