| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus and a method for working which surely prevents working liquid from dropping for necessary work, which improves working efficiency and which can obtain an improvement in reliability, and to provide a method for manufacturing a wafer. SOLUTION: The apparatus for working comprises a lower surface plate 2 having a polishing cloth 3 adhered thereto and the wafer W held on the cloth, an upper surface plate 6 having a polishing cloth 8 adhered thereto and separable from the wafer on the lower plate via the cloth 8, rotary shafts 1, 7 coupled to the lower and upper plates to rotatably drive the plates in predetermined directions, a polishing liquid supply mechanism 13 mounted at the upper plate to supply polishing liquid during working of the wafer, and a vacuum mechanism 15 detachably mounted in the supply mechanism to suck the liquid retaining in the supply mechanism at the time of necessary working after working in a predetermined amount to prevent the liquid from dropping from the upper plate.</p> |
