Upright-pin-joined resin substrate, method of producing the substrate, pins, and method of producing the pins

摘要

An upright-pin-joined resin substrate 11 includes a resin substrate 13 formed from a resin or a similar material and having a main plane 13A and a pin pad 17AP exposed on the main plane; and a number of pins 1 joined to the pin pads 17AP by means of a solder HD. The pins 1 are obtained by shaping a wire material MT which is formed of 194 Alloy and has been heat-treated in advance at 450° C. to 900° C. The pin 1 includes a shaft portion 1A and an enlarged-diameter portion 1B having a round surface projecting in a direction opposite the shaft portion 1A. The enlarged-diameter portion 1B and another portion are joined to the pin pad 17AP through soldering. Also disclosed is a method of producing the upright-pin-joined resin substrate; a pin to be employed in the upright-pin-joined resin substrate; and a method of producing the pin.