发明名称 |
Cooling structure and method of manufacturing the same |
摘要 |
A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids (18) is then cut into the masking material by a laser engraving process which exposes portions of the substrate surface. A plurality of supports (20) are then formed by electroplating a support material onto the exposed portions of the substrate surface. A layer of material is then electroplated onto the supports and over the masking material to form a skin that interconnects the supports. Finally, the remaining portions of the masking material are removed to form a plurality of cooling channels (26) defined by the supports, skin and substrate surface. An additional layer of material (42) may be deposited onto a top surface (50) of the cooling feature to provide additional thermal and/or mechanical protection.
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申请公布号 |
US2003026697(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20010921084 |
申请日期 |
2001.08.02 |
申请人 |
SIEMENS WESTINGHOUSE POWER CORPORATION |
发明人 |
SUBRAMANIAN RAMESH;KEYSER MERCEDES |
分类号 |
C25D1/02;F01D5/18;(IPC1-7):F01D5/18 |
主分类号 |
C25D1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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