| 摘要 |
PURPOSE: A test mounting apparatus for surface mount device package is provided to form a temporary electric contact between terminal leads or lands of various device package without a damage of a device or an input/output terminal by improving a structure of the test mounting apparatus. CONSTITUTION: A test mounting apparatus for surface mount device package includes a guide member(21), a support base(25), a bending plate(60), a contact finger(40), and an increase and decrease portion. The guide member(21) includes the first side, the second side opposite to the first side, and a plurality of guide holes. The support base(25) has an inner surface, an outer surface opposite to the inner surface, and a plurality of guide holes. The support base(25) is parallel to the second side of the guide member(21). The bending plate(60) has holes corresponding the guide holes of the guide member(21). The contact finger(40) has the first free end portion, the second free end portion(43), and a shank. The increase and decrease portion increases or decreases a gap between first free end portion and the second free end portion(43). |
