| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which will not crack and little warpages or deformations against bulk wiring layers or metal wiring boards laid closely to reduce the inductance, and has a wiring dealing with higher current and higher frequency constitutions. SOLUTION: An insulation board 1, composed of a plurality of laminated insulation layers, and at least two bulk wiring layers 4a, 4b composed of conductors laid on the surface of the board 1 and/or buried in voids of at least 30μm deep in the board 1, the layers 4a, 4b are disposed in a multiple layer, so that currents flow in mutually opposite directions and they are partly overlapped via the insulation layer 1b in a plan view, the insulation layer 1b between the two bulk layers 4a, 4b has a thickness of 50μm or more, and the bulk layers 4a, 4b has a thickness three times or less the thickness of the insulation layer 1b. |
