发明名称 METHOD AND STRUCTURE FOR SPLICING SHIELDED WIRE AND GROUND WIRE
摘要 PROBLEM TO BE SOLVED: To facilitate the operation of splicing a shielded wire and a ground wire. SOLUTION: A shielded wire 10 has a conductive layer 13 made of metal foil or the like which is formed on the periphery of an insulating covering layer 12 around a core wire 11, and an outermost insulating layer 14 made of thermoplastic resin 15a which is formed around the conductive layer. A ground wire 20 formed by covering core wires 21 with an insulating layer 22 made of thermoplastic resin 15b is placed on the periphery of the shielded wire 10 so that both the wires are in parallel with each other. The shielded wire 10 and the ground wire 20 are together covered with a mesh 30 made of conductive metal 31, and the mesh 30 is melted by heating at a temperature higher than the melting temperatures of the insulating layers 14 and 22. Thus, the mesh 30 is caused to dig into the melted insulating layers 14 and 22 and is brought into contact with the core wires 21 in the ground wire 20 and the conductive layer 13 of the shielded wire 10 to electrically connect together the core wires and the conductive layer. The melted thermoplastic resin 15a and 15b is cured on the periphery of the mesh 30, which is thus insulated and covered.
申请公布号 JP2003032828(A) 申请公布日期 2003.01.31
申请号 JP20010208544 申请日期 2001.07.09
申请人 SUMITOMO WIRING SYST LTD 发明人 NAKAMURA TETSUYA
分类号 H02G1/14;H02G3/38 主分类号 H02G1/14
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