| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method, capable of reliably manufacturing a flat wiring board which has a flat buildup layer, only above the surface of a core board and recesses formed into the backside of the core board, allowing electronic components to be mounted. SOLUTION: The method of manufacturing a wiring board 1 comprises a step of stacking a first core board 2 on a second core board 6 and adhering them with an adhesive layer 5 laid between the first and second core boards 2, 6 around an insulative intermediate S sandwiched between the first and second core boards 2, 6 which are opposed in the thickness direction.</p> |
