| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of solving the conventional problem about the alignment and mounting an electronic component on the rear surface of a plane circuit board. SOLUTION: In this plane circuit board manufacturing method, a metal film (2) is deposited on the one surface of an electrical insulating film (1), and the optionally demarcated part is removed from the metal film (2) for the formation of a conductor pattern; the other surface of the insulating film (1) is additionally coated with a protective layer (3), and the protective layer (3) is turned into a shape of a mask, and the region of the electrical insulating film (1), which is not covered with the mask (3.1), is removed completely.
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