发明名称 |
Oblique deposition apparatus |
摘要 |
An oblique sputtering deposition apparatus is provided for preparing a thin film. A collimator having angled passages for filtering out particles from stray directions is placed between the substrate and the incident particle flux. The angle of the passages can be adjusted from about 0 to about 90° with respect to the substrate normal according to requirements. The oblique incidence of particle flux brings forms a column structure which is also angled.
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申请公布号 |
US2003019745(A1) |
申请公布日期 |
2003.01.30 |
申请号 |
US20020099701 |
申请日期 |
2002.03.14 |
申请人 |
DATA STORAGE INSTITUTE. |
发明人 |
WANG JIAN-PING;SHI JIANZHONG |
分类号 |
C23C14/22;C23C14/34;H01J37/34;(IPC1-7):C23C14/34;C23C16/00 |
主分类号 |
C23C14/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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