COPPER ALLOY FOIL FOR LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a copper alloy foil which has good adhesive properties to an adhesive containing an epoxy resin even without executing roughing in a three-layer flexible board, which can be laminated to a copper-clad laminate and which has a small surface roughness and high conductivity and strength. SOLUTION: The copper alloy foil for the laminate comprises a rustproof film having a thickness of 3 nm or less on a copper alloy containing a specific element. In this case, the adhesive properties to an adhesive containing an epoxy resin are good. Its surface roughness is a 10-point mean surface roughness (Rz) of 2μm or less. The foil has a 180 deg. peeling strength when a board film is adhered with the adhesive containing the epoxy resin without roughing of 8.0 N/cm or less.