发明名称 |
Epoxy resin composition, laminate film using the same, and semiconductor device |
摘要 |
An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.
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申请公布号 |
US6512031(B1) |
申请公布日期 |
2003.01.28 |
申请号 |
US20000550287 |
申请日期 |
2000.04.14 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
HONDA TSUYOSHI;WAKAO MIYUKI;SHIOBARA TOSHIO |
分类号 |
C08G59/18;C08G59/56;C08K5/50;C08K9/02;C08L63/00;H01L21/56;H01L23/29;(IPC1-7):C08K5/49;C08K3/00;H01L29/12 |
主分类号 |
C08G59/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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