| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component and its manufacturing method which has a strength resistance durable enough against thermal stresses due to mounting soldering processes and warp/deformation of a circuit board at mounting, thereby preventing the crack or damage, and can be easily manufactured, without complicating its manufacturing process. SOLUTION: Ceramic insulation films 1 and conductor patterns 2 are stacked in an adequate order to form a chip body 3 containing coils 20 of the patterns 2 spirally connected therein. Conductive films 400, 400 forming part of outer electrodes 4, 4 are provided at least both ends the bottom of the chip body 3. A ceramic film layer 7 is provided in a recess of this bottom between the inner side edges of the opposed conductive films 400, 400, thereby covering the recess. The body 3 is baked, dipped and plated one after another to form the outer electrodes 4, 4 of a three-layer structure.
|
