摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component capable of improving productivity by shortening the tact time. SOLUTION: The apparatus for mounting the electronic component picks up the electronic component P by a transfer head 9 from a component supply unit and transfers and mounts the component on a board. The apparatus comprises the transfer head 9 having a plurality of suction nozzles 9a and a camera 10 having an image capturing region 10a corresponding to dispositions of the suction nozzles 9a by a transfer block 9 for moving by an X-axis table 7. The apparatus introduces a reflected light from the component P to the camera 10 by mirrors 11a, 11b of a reflecting unit 11 disposed in a disposing width including an array range of parts feeder between a component supply unit and the board on the way of this movement, captures its image, and recognizes the component P. Thus, the head 9 can be moved along a shortest route in each mounting pattern. |