发明名称 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component capable of improving productivity by shortening the tact time. SOLUTION: The apparatus for mounting the electronic component picks up the electronic component P by a transfer head 9 from a component supply unit and transfers and mounts the component on a board. The apparatus comprises the transfer head 9 having a plurality of suction nozzles 9a and a camera 10 having an image capturing region 10a corresponding to dispositions of the suction nozzles 9a by a transfer block 9 for moving by an X-axis table 7. The apparatus introduces a reflected light from the component P to the camera 10 by mirrors 11a, 11b of a reflecting unit 11 disposed in a disposing width including an array range of parts feeder between a component supply unit and the board on the way of this movement, captures its image, and recognizes the component P. Thus, the head 9 can be moved along a shortest route in each mounting pattern.
申请公布号 JP2003023296(A) 申请公布日期 2003.01.24
申请号 JP20010205858 申请日期 2001.07.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAJI HIROSHI;HIDESE WATARU;NAKAHARA KAZUHIKO;YANO KEIJI;MUKOJIMA HITOSHI;SATO SEIICHI;HATASE TAKAYUKI;NAKAMICHI MASAYASU
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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