发明名称 Apparatus for fabricating a semiconductor device
摘要 An apparatus for fabricating a semiconductor device in which an O-ring can be protected from any thermal damage when used for sealing a reaction chamber or a quartz tube in a high temperature process, the apparatus comprising: a reaction chamber having an upper chamber with an upper flange and a lower chamber with a lower flange, the upper and lower flanges being coupled to define a reaction space sealed from the outer atmosphere; an O-ring inserted between the upper and lower flanges; a heater arranged within the reaction chamber; a water pipe provided within the lower flange; a metal seal provided to the upper surface of the lower flange of the reaction chamber; and a cooling flange provided with a water pipe adapted for cooling water to flow through the water pipe, the cooling flange being coupled with the upper flange of the reaction chamber so that the metal seal can be pressed onto the upper surface of the upper flange of the reaction chamber. With the apparatus, efficiency of cooling water can be maximized by use of a metal seal so that the O-ring close to a high temperature part can be protected from any thermal damage.
申请公布号 US2003015142(A1) 申请公布日期 2003.01.23
申请号 US20010913652 申请日期 2001.08.15
申请人 HWANG CHUL JU;SHIM KYUNG SIK 发明人 HWANG CHUL JU;SHIM KYUNG SIK
分类号 H01L21/324;C23C16/44;H01L21/00;(IPC1-7):C23C16/00;C23F1/00 主分类号 H01L21/324
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