METHOD FOR FABRICATING MULTI-LAYERS PCB

摘要

PURPOSE: A method for fabricating a multi-layered PCB(Printed Circuit Board) is provided to improve reliability of the multi-layered PCB by preventing contamination due to adhesive resin and applying an uniform pressure into a cavity. CONSTITUTION: A filling resin(32) is formed between the top layer of a PCB(33) and a glass plate(1). A frame(34) is located around an upper portion of the filling resin(32). Cushion pads(30) are located on an upper end and a lower end of the glass plate(1), respectively. A film(31) is formed between the glass plate(1) and the cushion pad(30), between the cushion pad(30), and a PCB(33), and frame(34) and the film(31). The frame(34) is used for applying uniformly pressure to a plurality of substrates having multi-layers when the plural substrates are stacked. The frame(34) has height of 0.5 to 1.5mm and width of 200 to 300mm.