发明名称 BURRING DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a burring die device capable of burring a plate with different thickness or different diameter of a prepared hole without changing a die. SOLUTION: An upper die 2 and a lower die 3 are constituted by a plurality of kinds of burring dies 4 and burring punches 12 according to the thickness of a plate 7 to be burred and the diameter of the prepared hole 7a, and at least one of the burring die 4 and the burring punch 12 is switched to the burring position O between the upper die 2 and the lower die 3 by a switching means. The prepared hole 7a can be burred without changing the die by switching the burring die 4 and the burring punch 12 according to the thickness and the diameter to the burring position O by the switching means 13 when the thickness of the plate 7 to be barred and the diameter of the prepared hole 7a are changed, and thus, the step-up time can be considerably shortened, the rate of operation of a machine is improved, and the productivity is improved thereby.
申请公布号 JP2003019522(A) 申请公布日期 2003.01.21
申请号 JP20010204265 申请日期 2001.07.05
申请人 HITACHI COMMUNICATION TECHNOLOGIES LTD 发明人 IGARASHI MASAHARU
分类号 B21D19/08;B21D28/10;(IPC1-7):B21D28/10 主分类号 B21D19/08
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