METHOD FOR MANUFACTURING RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To relax restrictions on the arrangement of external terminals in a resin sealed semiconductor device. SOLUTION: A heat plate 50 is provided with protruding portions 51 for supporting half etched parts Phe of first signal connecting leads 14a. A lead frame 10, to which a resin film 40 is attached, is provided on the heat plate 50, and metal fine wires 25 are connected to the half etched parts Phe of the first signal connecting lead 14a. When the metal fine wires are connected to the half etched parts Phe of each signal connecting lead 14a, 14b, pressing force and/or heat can be effectively added to connecting parts.