| 摘要 |
PROBLEM TO BE SOLVED: To improve the density of a surface mount light emitting device mounted on a circuit board. SOLUTION: A front surface-side opening end 14a and a rear surface-side opening end 14b of a first through hole 14 are arranged on the respective surfaces of die bonding electrode 18 and a first surface mount electrode 22 which are formed in a substrate 12, and an LED chip 30 is bonded on the die bonding electrode 18. Thus, a space for forming the die bonding electrode 18 on the substrate 12 and a space for connecting electrically the die bonding electrode 18 and first surface mounting electrode 22 can be used in common, resulting in making the horizontal width of the substrate 12 smaller by common space. Then, the first surface mount electrode 22 can be connected with the wiring pattern 40a of a circuit board 38 with solder 42a, so that no space is needed for soldering excluding mounting of a light emitting device 10 to the circuit board 38. |
