发明名称 METHOD OF FORMING THICK FILM
摘要 PROBLEM TO BE SOLVED: To provide a forming method by which a thick film pattern comprising a photosensitive material can be obtained with a good accuracy. SOLUTION: The method for forming the thick film includes at least a process for forming the thick film on a substrate by using the photosensitive material and a drying process. In the method for forming the thick film, the change in weight of the thick film by drying is set to be >=10% and <=20% of the weight of the formed thick film.
申请公布号 JP2003015316(A) 申请公布日期 2003.01.17
申请号 JP20010201631 申请日期 2001.07.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUMITA KEISUKE;YONEHARA HIROYUKI;FUJITANI MORIO;ASHIDA HIDEKI
分类号 G03F7/26;H01J9/02;H01J11/22;H01J11/34;H01J11/36;(IPC1-7):G03F7/26;H01J11/02 主分类号 G03F7/26
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