发明名称 |
METHOD OF FORMING THICK FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a forming method by which a thick film pattern comprising a photosensitive material can be obtained with a good accuracy. SOLUTION: The method for forming the thick film includes at least a process for forming the thick film on a substrate by using the photosensitive material and a drying process. In the method for forming the thick film, the change in weight of the thick film by drying is set to be >=10% and <=20% of the weight of the formed thick film. |
申请公布号 |
JP2003015316(A) |
申请公布日期 |
2003.01.17 |
申请号 |
JP20010201631 |
申请日期 |
2001.07.03 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUMITA KEISUKE;YONEHARA HIROYUKI;FUJITANI MORIO;ASHIDA HIDEKI |
分类号 |
G03F7/26;H01J9/02;H01J11/22;H01J11/34;H01J11/36;(IPC1-7):G03F7/26;H01J11/02 |
主分类号 |
G03F7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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