| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive type resist composition suitable for use under a light source for exposure which emits light of <=160 nm, particularly F2 excimer laser light (157 nm) and more specifically to provide a positive type resist composition having improved surface roughness and scum. SOLUTION: Each of the positive type resist compositions contains (A) a resin which has specified repeating units (1), repeating units (2) which are decomposed by the action of an acid to increase the solubility of the resin in an alkali developing solution and repeating units (3) inert to the action of the acid, having no alkali-soluble group and containing at least one fluorine atom and is decomposed by the action of the acid to increase its solubility in the alkali developing solution and (B) a compound which generates the acid when irradiated with active light or radiation. |
