发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent failure at releasing a pod with a pod opener. SOLUTION: A wafer delivery port 13 which delivers wafer 9 between a pod 10 and a boat 8 is provided with a pod opener 20 which opens/closes a wafer delivery opening 10b, with a door 10a of the pod 10 attached/detached. A chamber 60 which covers a wafer take-in/out opening 22 of a base 21 is installed at the base 21 of the pod opener 20. An air supply pipe 13 and an air discharge pipe 64 are connected to the chamber 60 for communication of nitrogen gas 62 with a closure housing room 61. At releasing of the pod, the closure housing room 61 of the chamber 60 is filled with the nitrogen gas 62, so that the air and water content in the closure housing room 61 and a wafer housing chamber 10c of the pod 10 are purged with the nitrogen gas 62. Since the atmosphere in the pod is prevented from being released into a wafer transportation space, the contamination of the transportation space, rising of oxygen concentration, oxydation of a wafer, and sticking of particles are prevented.
申请公布号 JP2003007801(A) 申请公布日期 2003.01.10
申请号 JP20010189380 申请日期 2001.06.22
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TATENO HIDETO;YANAGAWA HIDEHIRO
分类号 B65G49/00;B65G49/07;C23C16/44;H01L21/205;H01L21/22;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/00
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