DUMMY WAFER AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A dummy wafer and a method for fabricating the same are provided to improve stiffness and toughness of the dummy wafer by simplifying a fabricating process of the dummy wafer. CONSTITUTION: A complex material is stacked on a metal film of a predetermined size in order to obtain mutual isotropy(S110). A mold is pressed on an exposed of the complex material(S120). The mold, the complex material, and metal film are packed with a vacuum bag, a vacuum state is formed in the inside of the vacuum bag, and the vacuum bag is loaded into an autoclave(S130). The mold is printed on the complex material by increasing temperature and pressure of the autoclave and an adhesive resin is hardened by performing a heating process(S140). The complex material and the metal film are removed from the metal and a dummy wafer is formed by performing a cutting process(S150). Nickel or cooper is plated on a surface of the dummy wafer(S160).