| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for a surface-mounting LED, together with its manufacturing method, where, after an outer lead part is bent, troubles such as poor adhesion or peeling between a resin and a lead frame, that between a semiconductor chip and the lead frame, cracking of a semiconductor chip 3, poor connection or disconnection of a wire, etc., are hardly taken place. SOLUTION: An outer lead is bent after a metal rod material is punched and a resin is insert-molded, and before a semiconductor chip is fitted to the insert-molded resin. |
