发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a structure leading to realization of a power management semiconductor device and an analog semiconductor device that can be manufactured at low cost in a short manufacturing term, operate on low voltage with low power consumption, and having a high drivability and a sophisticated function with high precision. The method is for manufacturing a P−type polycide structure for a power management semiconductor device and an analog semiconductor device including a CMOS and a resistor. The P−type polycide structure is a multilayer one of a P−type polycrystalline silicon layer and a refractory metal silicide layer, in which the conductivity type of the gate electrode of the CMOS is the P−type whether if the CMOS is an NMOS or a PMOS. The resistors used in a voltage−dividing circuit and a CR circuit are formed of polycrystalline silicon in a layer different from the layer of the gate electrode.
申请公布号 WO03001592(A1) 申请公布日期 2003.01.03
申请号 WO2002JP06072 申请日期 2002.06.18
申请人 SEIKO INSTRUMENTS INC.;HASEGAWA, HISASHI;OSANAI, JUN 发明人 HASEGAWA, HISASHI;OSANAI, JUN
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8234;H01L21/8238;H01L27/06;H01L27/092;(IPC1-7):H01L21/823 主分类号 H01L27/04
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