发明名称 |
Semiconductor module, power converter using the same and manufacturing method thereof |
摘要 |
In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost. In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized. <IMAGE> |
申请公布号 |
EP1032042(A3) |
申请公布日期 |
2003.01.02 |
申请号 |
EP20000301385 |
申请日期 |
2000.02.22 |
申请人 |
HITACHI, LTD. |
发明人 |
SASAKI, YASUSHI;MAENO, YUTAKA;FUJI, HIROSHI;NAKATSU, KINYA;OGAWA, TOSHIO;TAMBA, AKIHIRO;YAMADA, KAZUJI |
分类号 |
H02M7/04;H01L25/16;H02M7/48;H05K1/14 |
主分类号 |
H02M7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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