发明名称 Process of thermal oxidation of an implanted semiconductor substrate
摘要 Production of a dielectric on a semiconductor substrate (2) comprises implanting ions into a surface layer of the substrate so that the ions form a first dielectric layer (7) and carrying out a thermal oxidation process to form a second dielectric layer (8) on the first dielectric layer. Preferably the substrate is a silicon substrate. The implanted ions are nitrogen ions. The substrate surface is cleaned before the dielectric is formed on its surface.
申请公布号 EP1271635(A1) 申请公布日期 2003.01.02
申请号 EP20010110132 申请日期 2001.05.03
申请人 INFINEON TECHNOLOGIES AG 发明人 KERBER, MARTIN;WURZER, HELMUT;POMPL, THOMAS
分类号 H01L21/265;H01L21/28;H01L21/314;H01L21/316;H01L29/51 主分类号 H01L21/265
代理机构 代理人
主权项
地址