发明名称 |
Process of thermal oxidation of an implanted semiconductor substrate |
摘要 |
Production of a dielectric on a semiconductor substrate (2) comprises implanting ions into a surface layer of the substrate so that the ions form a first dielectric layer (7) and carrying out a thermal oxidation process to form a second dielectric layer (8) on the first dielectric layer. Preferably the substrate is a silicon substrate. The implanted ions are nitrogen ions. The substrate surface is cleaned before the dielectric is formed on its surface. |
申请公布号 |
EP1271635(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
EP20010110132 |
申请日期 |
2001.05.03 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
KERBER, MARTIN;WURZER, HELMUT;POMPL, THOMAS |
分类号 |
H01L21/265;H01L21/28;H01L21/314;H01L21/316;H01L29/51 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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