发明名称 |
Magnetic head provided with resin-molded IC bare-chip between height-restriction plate and suspension and method for manufacturing magnetic head |
摘要 |
A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.
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申请公布号 |
US2003002219(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20020183899 |
申请日期 |
2002.06.27 |
申请人 |
ALPS ELECTRIC CO., LTD. |
发明人 |
WATANABE MITSURU |
分类号 |
G11B5/60;G11B5/48;G11B21/21;(IPC1-7):G11B5/48 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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