Polishing pad, and method and apparatus for polishing

摘要

A polishing pad characterized by having a mechanism for supplying water to the plane of the polishing pad in contact with the article to be polished, in particular, in case the mechanism comprises a domain structure having an area of 1x10-6 m2 or smaller, reduces the generation of scratches and the dust adhesion on the surface of the article to be polished, while increasing polishing rate at low dishing and erosion; hence, the product is applicable to the field of surface polishing of semiconductor thin films.