发明名称 Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
摘要 A composite flexible wiring board 100 comprises a first flexible wiring board 10 and a second flexible wiring board 30 on which a surface-mounted part 44 is provided. The second flexible wiring board 30 is disposed on the first flexible wiring board 10 in its predetermined area. The first flexible wiring board 10 and the second flexible wiring board 30 are electrically connected to each other through an interlayer contact portion 50 provided in a predetermined position. The first flexible wiring board 10 has an input terminal region 11A and an output terminal region 11B with a power IC chip 18 mounted on the first flexible wiring board. There is thus provided a composite flexible wiring board including surface-mounted parts and being able to constitute a hybrid IC, a method of manufacturing the composite flexible wiring board, an electro-optical device, and electronic equipment. <IMAGE>
申请公布号 EP1085788(A3) 申请公布日期 2003.01.02
申请号 EP20000307782 申请日期 2000.09.08
申请人 SEIKO EPSON CORPORATION 发明人 OISHI, EIJI;ENDO, KOGO
分类号 G02F1/1345;G02F1/13;G02F1/1333;G09F9/00;H05K1/14;H05K1/18;H05K3/28;H05K3/32;H05K3/36;H05K3/46 主分类号 G02F1/1345
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