| 发明名称 |
Polishing pads and methods relating thereto |
| 摘要 |
This invention describes improved polishing pads useful in the manufacture ofsemiconductor devices or the like. The pads of the present invention may have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
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| 申请公布号 |
US6500053(B2) |
申请公布日期 |
2002.12.31 |
| 申请号 |
US20020071668 |
申请日期 |
2002.02.08 |
| 申请人 |
RODEL HOLDINGS, INC. |
发明人 |
JAMES DAVID B.;COOK LEE MELBOURNE;BAKER ARTHUR RICHARD |
| 分类号 |
B24B37/04;B24D3/34;B24D11/00;B24D11/04;B24D13/12;B24D13/14;C08J5/14;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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