| 摘要 |
A projection exposure method and apparatus, in which a substrate, which is placed on a stage that is movable in a direction of an optical axis of a projection optical system or in a direction perpendicular thereto, is moved in the direction perpendicular to the optical axis of the projection optical system in order to successively move and position a plurality of exposure areas on the substrate to respective predetermined exposure locations. Then, the amount of displacement of each of the exposure areas of the substrate surface from an optimal image forming location of the projection optical system is measured. The substrate surface, based on the measured values, is moved for alignment with the optimal image forming location. Thereafter, the substrate surface is exposed. In the projection exposure method and apparatus, when the substrate surface is being exposed, a correction value for correcting an offset amount, corresponding to the amount of displacement obtained after moving and positioning the exposure areas on the substrate such that the substrate surface is aligned with the optimal image forming location, is previously determined and stored. In addition, during exposure, the measured displacement is corrected based on the correction value in order to move and position the substrate to the optimal image forming location.
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